Digital Design of Hybrid Memory Cube

This is a revolutionary technology in memory design,  high speed and less area are the main point. 

Why do we need Hybrid Memory Cube ? 
The requirement comes to support the today's high speed devices,  most of the memory controller consumes time in accessing READ/WRITE memory.

If you need to access 100Gbps , you will require dozens READ/WRITE access , Those READ/WRITE access will contains packet encoding/decoding logic , queuing, scheduling , CRC check, and other things before sending out/in the memory contents.
Creating that kind of architecture is a challenge as you will required
1. High access availability
2. High system power
3. More logic to handle multiple tasking
4. Synchronous interface


How HMC overcome above problem   ?

(From Wikipedia)
Hybrid Memory Cube (HMC) is a new type of computer RAM technology developed by Micron Technology. The Hybrid Memory Cube Consortium (HMCC) is backed by several major technology companies including Samsung, Micron Technology, ARM, HP, Microsoft, Altera, and Xilinx.
The HMC uses 3D packaging of multiple memory dies, typically 4 or 8 memory dies per package, with using of through-silicon vias (TSV) and microbumps. It has more data banks than classic DRAM memory of the same size. The Memory controller is integrated into memory package as a separate logic die.The HMC uses standard DRAM cells, but its interface is incompatible with current DDRn (DDR2 or DDR3) implementations.

HMC Features :
* Support 10Gbps, 12.5Gbps or 15Gbps SerDes I/O interface
* Support packet size 16,32,48, 64, 80, 96, 112, 128 byte per request 
* Error detection (CRC) with automatic retry
* Power Management
* Through-silicon via (TSV) Technology
* BIST
* JTAG




Ref :- 
1. Microsoft backs Hybrid Memory Cube tech // by Gareth Halfacree, bit-tech, 9th May 2012
2. Hybrid Memory Cube (HMC), J. Thomas Pawlowski (Micron) // HotChips 23