QUIZ : Physical Implementation

⏳ IC Packaging Quiz

Time Left: 90 seconds

1. What is the purpose of die attach in IC packaging?

Testing the chip

Attaching the chip to the substrate

Adding protection layer

Cutting the wafer

2. Which technique uses solder bumps to connect the chip?

Wire bonding

Flip-chip

Encapsulation

Laser dicing

3. What is the main function of encapsulation?

Enhance performance

Connect to power supply

Protect the die from damage

Conduct burn-in testing

4. What is wafer dicing?

Attaching chip to board

Dividing wafer into individual dies

Etching circuits

Connecting pins to the chip

5. Which of the following is a common package type?

XML

DIP

HTML

BJT

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