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Enhance knowledge in Digital VLSI domain - By Rahul Jain
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Apr 13, 2025
QUIZ : Physical Implementation
IC Packaging Quiz - Timed
⏳ IC Packaging Quiz
Time Left:
90
seconds
1. What is the purpose of die attach in IC packaging?
Testing the chip
Attaching the chip to the substrate
Adding protection layer
Cutting the wafer
2. Which technique uses solder bumps to connect the chip?
Wire bonding
Flip-chip
Encapsulation
Laser dicing
3. What is the main function of encapsulation?
Enhance performance
Connect to power supply
Protect the die from damage
Conduct burn-in testing
4. What is wafer dicing?
Attaching chip to board
Dividing wafer into individual dies
Etching circuits
Connecting pins to the chip
5. Which of the following is a common package type?
XML
DIP
HTML
BJT
Submit Quiz
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